Why perform cross-sectional evaluation of circuit boards (PCB)? | Element
Applied Sciences | Free Full-Text | Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock
Applying microscopic analytic techniques for failure analysis in electronic assemblies | Applied Microscopy | Full Text
The Role of Aluminium in Continuous Galvanizing - Ark Novin
Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints
Microsection / Cross-Section Analysis
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces | Emerald Insight
Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient | Scientific Reports
The HDG Coating | American Galvanizers Association
Materials | Free Full-Text | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
What are Intermetallics and How Can We Overcome the Failures Associated with Them?
Hurtony Tamás
Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders
Evaluation of intermetallic compound layer at aluminum/steel interface joined by friction stir scribe technology - ScienceDirect
Microsection | BGA Cross Section Analysis
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints | I am a Manufacturing Process Engineer (MPE)
Cross-Sectional Analysis — Elmet
Cross section morphology of Cu 6 Sn 5 IMC grown at the interface of... | Download Scientific Diagram
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad - ScienceDirect
Effect of shape-memory alloy NiTi fiber on microstructure and mechanical properties of continuous ceramic Al2O3 fiber-reinforced Ti/Al3Ti metal– intermetallic laminated composite - Yuqiang Han, Junyi Zhu, Haoran Yan, Chunfa Lin, Zhilei Zhao, Xuecong
Figure 2 from Investigation of the wetting properties of Cu6Sn5 intermetallic compound | Semantic Scholar
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？ | I am a Manufacturing Process Engineer (MPE)
Cross-Sectional Analysis — Elmet
Cross-section BSE images of the substrate-side IMC layers after thermal... | Download Scientific Diagram
